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NTPC Signs MoU with Society for Integrated Circuit Technology & Applied Research
Posted On : 2006-11-07 07:53:56( TIMEZONE : IST )
National Thermal Power Corporation Ltd (NTPC) has announced that the Company has signed a Memorandum of Understanding (MoU) on November 07, 2006 with Society for Integrated Circuit Technology and Applied Research for identifying global technology know how provider(s) and technology transfer for manufacturing of white LED Lamps.
